Cryo-FIB Minimizes Ga Milling Artifacts in Sn
نویسندگان
چکیده
Since FIB was first introduced, one of the major applications has been to mill site-specific crosssectioned sample surfaces [1]. This approach not only allows SEM access to the structural information buried under the surface, but it is also the first step of making TEM lamellae using FIB. Importantly, there are many reports of beam-induced damage due to FIB processing. Here, we report on artifacts induced when milling metallic Sn with Ga ions and how this problem can be minimized via cryo-FIB.
منابع مشابه
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